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Introduction to the manufacturing process of TFT-LCD LCD panels

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The following components are included in the TFT-LCD LCD panel manufacturing process: the process of forming a TFT array on a TFT substrate; the process of forming the color filter pattern and the ITO conductive layer on the color filter substrate liquid crystal cells are formed by stacking two substrates together. Set up the peripheral circuitry, assemble the backlight module assembly, and so on.

1. The process of forming a TFT array on a TFT substrate (see Figure 1).
Amorphous silicon TFTs (A-Si TFTs), polycrystalline silicon TFTs (P-Si TFTs), and monocrystalline silicon TFTs (C-Si TFTs) are the three types of TFTs used in industrial applications. Currently, the A-SI TFT is the most widely used type of display.

The fabrication process for A-Si TFTs consists of sputtering the gate material film onto a borosilicate glass substrate, followed by exposure with a mask, development, and dry etching to form the gate routing pattern. For general mask exposure, a step exposure machine is used.
After that, using the PECVD method, continuous film formation is carried out to form Sinx film, non-doped a-Si film, and phosphorus-doped N +a-Si film. After that, the TFT portion of the A-Si pattern was created through the use of mask exposure and dry etching.


A transparent electrode (ITO film) is formed in the third step using the sputtering film formation method, and a display electrode pattern is then formed using a mask exposure and wet etching procedure to complete the process.
A dry etching method is used to form the contact hole pattern of the gate end insulation film in the fourth step, which is accomplished through mask exposure and dry etching.


The fifth step involves sputtering aluminum and other metals into a film, followed by the use of a mask to expose and etch the TFT's source 5 inch tft display, drain, and signal line patterns. Using the PECVD method, the protective insulating film is formed, and then the insulating film is etched and formed using the mask exposure and dry etching method (the protective film is used to protect the gate, the electric extremity of the signal line, and the display electrode). At this point, the entire procedure has been completed.

The TFT array process is critical to the TFT-LCD manufacturing process and also represents a significant portion of the equipment investment. The entire process necessitates extremely high purification standards (for example, grade 10).

2. The formation of a color filter pattern on a color filter (CF) substrate is described in detail in Section 2.

The dye method, the pigment dispersion method, the printing method, the electrodeposition method, and the inkjet method are all options for creating a color filter. As of right now, the pigment dispersion method is the most widely used.

First, fine pigments with uniform particles (average particle size less than 0.1 m) (R, G, and B tricolor) are dispersed in a transparent photosensitive resin, which is the first step in the pigment dispersion method. After that, they are sequentially coated, exposed, and developed to produce the R. G. B. trichromatic pattern on the photographic paper. This technology is used in the manufacturing industry, and the devices that are used primarily include coating, exposure, and developing devices.

It is common practice to add a black matrix (BM) at the RGB tri-color junction to prevent light leakage. Sputtering was previously used to create monolayer metal chromium films, but now it is also used to create metal chromium and chromium oxide composite BM films, as well as a resin, mixed carbon resin BM film.

BM also requires the fabrication of a protective film and an IT0 electrode, as the color filter-coated substrate serves as the front substrate of the LCD screen and the TFT-coated substrate serves as the rear substrate of the LCD screen, combining to form the liquid crystal box. As a result, we must pay close attention to the problem of positioning, so that the color filter of each unit and the TFT substrate pixel are identical.

3. The procedure for preparing the liquid crystal box

First, polyimide films were applied to the surfaces of the upper and lower substrates, respectively, and then, using a friction process, oriented films were formed, which were capable of inducing the molecules to arrange themselves in the desired manner. In the following step, a sealant material is applied around the TFT array's substrate before spraying the liner material on top of the substrate. At the same time, the silver paste was applied to the transparent electrode end of the CF substrate, which served as the electrode. The two substrates are then bonded together to form a pair of positive CF patterns and TFT pixel patterns, which is followed by a heat treatment to solidify the sealing material. When printing sealing material, it is necessary to remove the liquid crystal from the injection port to vacuum the material.

In recent years, technological advancements and the continuous expansion of the size of the substrate have resulted in a significant improvement in the box-making process. The most notable is the change in the method of injecting crystal, from the original method of injecting crystal into boxes to the ODF method, which is the process of injecting crystal and forming boxes at the same time. In addition, the pad lining method is no longer the traditional spray method, but rather photolithography applied directly to the array.

4. The module assembly process, which includes the assembly of peripheral circuits, the assembly of backlights, and so on.

Following the completion of the liquid crystal box manufacturing process, the external drive circuit must be installed on the panel, and the polarizer must adhere to the surfaces of the two substrates. It is also necessary to install a backlight if the LCD is of the transmission-style variety.

Material and process are the two most important factors influencing the performance of a product. TFT-LCDs are manufactured using the four main processes listed above, with a large number of steps in the complex manufacturing process to produce the final product we see.

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